Sony’s GigE Ver2.0 XGC cubic modules (29x29x42mm) come with PoE, and are 6 pin compliant.  These new models combine the best of Sony’s sensor technology with a strong heritage in camera development to deliver high frame rate performance of up to 130 fsp with industry leading low trigger latency, together with other new features such as shading correction, defect correction, sensitivity control and temperature read out.  GigE Ver2.0 interface also offers considerable advancements in termsof flow control and chunk data.

Arnaud Destruels of Sony said: "The XCG models provide impeccable functionality for customers transitioning from analogue to digital machine vision systems. At Sony we continue to focus on using our strong heritage in both sensor and complete camera technology development to bring the best solution to our customers needs”.