Leveraging Voyant’s proprietary Photonic Integrated Circuit (PIC), Helium offers camera-like simplicity and unmatched flexibility. Helium uses a dense two-dimensional photonic focal plane array with fully integrated 2D on-chip beam steering — eliminating all unreliable scanning methods: MEMS, mirrors, and resulting in no moving parts. The FMCW Lidar chip leverages a two-dimensional array of surface emitters to create a fully solid-state Lidar in an ultra-compact, rugged design. Helium also supports multi-sensor configurations, combining, for instance, a wide-FoV short-range and narrow-FoV long-range sensing in one system — promising the most versatile and cost-effective Lidar solution for advanced perception applications.

Helium first prototype release will be demonstrated at CES 2026 in Las Vegas, January 6-9, marking a major milestone in advancing silicon-photonics Lidar from R&D into high-volume systems that are proliferating Physical AI.

“Helium represents the next step in our mission to deliver the most affordable high performance Lidar sensor ever,” said Voyant CEO Clément Nouvel. “Industrial and consumer markets demand sensors that are small, cost efficient, and highly reliable. Helium provides all of that while delivering performance that unlocks new classes of intelligent machines.”

Helium sensors and modules will be available with multiple resolution and range configurations, supporting a wide choice of field-of-view options—from ultra-wide coverage approaching 180° down to narrower, long-range targeting optics. These modular variants enable OEMs and developers to select and integrate lenses that best suit their application, allowing Lidar architectures to be tailored for mobile robots, material-handling systems, smart infrastructure, and emerging edge-compute platforms.

Early access programme

Voyant is opening early access to Helium for select OEMs and automation partners. Early collaborators will engage directly with Voyant’s engineering teams to explore custom chip resolution, FoVs, module configurations, multi-sensor fusion architectures, and software-defined scanning features.